Renishaw PLC, a company involved in business activities in engineering sector, has been recently granted a patent for invention titled “MEASUREMENT PROBE”.
The patent has been issued as granted patent number 305341 filed as application number 6963/DELNP/2007 having scope (abstract) of invention as:
“A probe for position determining apparatus has a probe body (18) and a workpiece-contacting stylus (14) A strain sensitive structure connects the probe body and the stylus, and includes bendable members (32). The bendable members have an asymmetric cross-section, e.g. “T” shaped. A strain gauge (33) is mounted to the stem of the “T” to detect the bending caused when the stylus contacts a workpiece. This enables the strain sensitive structure to be both robust and sensitive to the bending.”
The primary independent claim (claim 1) of this patent states:
“A probe for position determining apparatus, comprising: a probe body, a stylus holder, connected or connectable to a workpiece-contacting stylus, at least one bendable member, connected between the probe body and the stylus holder, which bends when the stylus contacts a workpiece, the bendable member having a neutral axis which is not subject to tension or compression during such bending, and at least one portion of the member lying off the neutral axis, said portion being subject to tension or compression during the bending, a strain-sensing element located on said portion which lies off the neutral axis, so as to produce an output signal when the stylus contacts a workpiece, the bendable member having a further portion which is closer to the neutral axis than the portion on which the strain-sensing element is located, said further portion having a greater stiffness than the portion on which the strain sensing element is located.”
The patent has been granted under International Patent Classification (IPC) G01B 7/012, which covers inventions related to:
“Contact-making feeler heads therefor”
This patent can be opposed under post-grant patent opposition within 12 months of the date of grant of this patent.
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